DocumentCode
3110022
Title
A complete transmit, receive, and LO buffer chip set in low cost SMT package covering 38 & 42 GHz applications
Author
Morkner, Henrik ; Fujii, Kohei ; Phan, Khantran ; Kumar, Sushil ; Niedzwiecki, Tony ; Ostermann, Brent
Author_Institution
M/A-COM Technol. Solutions Inc., Lowell, MA, USA
fYear
2010
fDate
23-28 May 2010
Firstpage
133
Lastpage
136
Abstract
The higher frequency bands of the point-to-point infrastructure radio have been the hardest to convert to SMT package. This paper describes complete solution that covers 37-45GHz in 4 SMT packaged chips. Transmit consist of 2 chips, an up-converter/VGA with 20dB gain control and power amplifier that provides 38dBm OIP3. The receiver is a single chip down-converter with less than 4.9dB NF. The single chip LO buffer provides frequency multiplication (×2) and +21dBm drive with ample harmonic suppression. An optional high directivity, temperature compensated, power detector is also available to aid forward error correction. The result is the most integrated and complete chip set known to be published or advertised.
Keywords
forward error correction; surface mount technology; 4 SMT packaged chips; buffer chip set; forward error correction; frequency 37 GHz to 45 GHz; frequency 38 GHz; frequency 42 GHz; gain 20 dB; harmonic suppression; noise figure 4.9 dB; point-to-point infrastructure radio; power amplifier; single chip down-converter; surface mount technology; Costs; Frequency conversion; Gain control; Harmonics suppression; Noise measurement; Packaging; Power amplifiers; Radiofrequency amplifiers; Receivers; Surface-mount technology; LO buffer; SMT package; down-converters; power amplifiers; power detectors; up-converters;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest (MTT), 2010 IEEE MTT-S International
Conference_Location
Anaheim, CA
ISSN
0149-645X
Print_ISBN
978-1-4244-6056-4
Electronic_ISBN
0149-645X
Type
conf
DOI
10.1109/MWSYM.2010.5515929
Filename
5515929
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