A variable gain MMIC SSPA

Author

Bates, D. ; Palena, P. ; Caporossi, P. ; LaPrade, J.

Author_Institution

GE Electron. Lab., Syracuse, NY, USA

fYear

1990

fDate

30 Sep-3 Oct 1990

Firstpage

475

Abstract

A variable gain amplifier module design using three monolithic microwave integrated circuit (MMIC) chips in a single custom ceramic package for satellite communication applications is described. Feedback is used in the MMIC amplifier design (SCAMP4) to be deliberately tolerant to process variations in providing excellent gain flatness. It is noteworthy that while the SCAMP4 design was derived from earlier broadband designs, the results reported are achieved with a single iteration of the four-stage circuit. Applications of the MMIC module in the front end of a solid-state power amplifier (SSPA) demonstrates a compact, high-gain design with a greatly reduced part count. Reduced alignment time and increased reliability are advantages also offered by application of MMIC amplifier modules to the SSPA design

Keywords

MMIC; application specific integrated circuits; microwave amplifiers; power amplifiers; satellite links; 3.7 to 4.2 GHz; SCAMP4; alignment time; amplifier module design; gain flatness; reliability; satellite downlink band; single custom ceramic package; solid-state power amplifier; variable gain MMIC SSPA; Application specific integrated circuits; Broadband amplifiers; Ceramics; Gain; Integrated circuit packaging; MMICs; Microwave amplifiers; Microwave integrated circuits; Monolithic integrated circuits; Satellite communication;

fLanguage

English

Publisher

ieee

Conference_Titel

Military Communications Conference, 1990. MILCOM '90, Conference Record, A New Era. 1990 IEEE

Conference_Location

Monterey, CA

Type

conf

DOI

10.1109/MILCOM.1990.117464

Filename

117464