Title :
Membrane probe card technology (the future for higher performance wafer test)
Author :
Leslie, Brian ; Matta, Farid
Author_Institution :
Hewlett Packard Co., Palo Alto, CA, USA
Abstract :
A probe card technology is described that addresses the needs of testing VLSI devices at the wafer level. This technology offers the ability to test high-pin count devices at operating speed with the same performance as obtained in package test. The design and performance characteristics of two implementations are summarized and the results of several applications are reviewed
Keywords :
VLSI; integrated circuit testing; IC testing; VLSI devices; flexible dielectric membrane; high-pin count devices; membrane probe card technology; wafer test; Biomembranes; Circuit testing; Electronic equipment testing; Frequency; Integrated circuit packaging; Laboratories; Maintenance; Probes; Transmission lines; Wire;
Conference_Titel :
Test Conference, 1988. Proceedings. New Frontiers in Testing, International
Conference_Location :
Washington, DC
Print_ISBN :
0-8186-0870-6
DOI :
10.1109/TEST.1988.207842
