Title :
Robust Operations of IEEE 802.11/WLAN and 802.15/WPAN Wireless Links in Industrial Informatic Networks
Author :
Neelakanta, Perambur S. ; Preedalumpabut, Wichean
Author_Institution :
Dept. of Electr. Eng., Florida Atlantic Univ., Boca Raton, FL
Abstract :
Presented in this paper are reliability aspects of short-range wireless (RF) communication links in factory environments supported by IEEE 802.11/WLAN and 802.15/WPAN. Corresponding factory applications involve establishing robust wireless links between end-entities like computer hosts, robots, sensor-mounted autonomous moving parts (of a machine), roaming workers as well as data-support systems (like servers storing inventory details etc.). Such RF transmissions on industrial platforms would face invariably harsh electromagnetic (EM) environment due to scattering, reflections, diffraction of EM waves and shadowing by objects abundantly present in the vicinity. Mutual interference from colocated RF systems and EM interference from non-communication appliances (like microwave ovens) may also exist. Then mitigation efforts towards robust operation proposed here refer to using hybrid and (circular) polarization (CP) diversity methods providing high diversity gain and reduced bit error rates (BER). Simulated experimental results are furnished; and, suggested are "self-healing" systems (on-a-chip) that can intelligently seek diversity through (error) self-validation.
Keywords :
electromagnetic wave diffraction; electromagnetic wave reflection; electromagnetic wave scattering; electromagnetic waves; information networks; personal area networks; production engineering computing; radio links; wireless LAN; 802.11/WLAN; 802.15/WPAN; EM waves; RF transmissions; industrial informatic networks; wireless communication links; Bit error rate; Diversity methods; Electromagnetic scattering; Informatics; Production facilities; Radio frequency; Radiofrequency interference; Robustness; Wireless LAN; Wireless sensor networks;
Conference_Titel :
Industrial Informatics, 2006 IEEE International Conference on
Conference_Location :
Singapore
Print_ISBN :
0-7803-9700-2
Electronic_ISBN :
0-7803-9701-0
DOI :
10.1109/INDIN.2006.275793