• DocumentCode
    3111730
  • Title

    Pain generation model on upper limb considering the laminated structure of skin

  • Author

    Matsunaga, Nobutomo ; Akayama, Seiko ; Kawaji, Shigeyasu

  • Author_Institution
    Grad. Sch. of Sci. & Technol., Kumamoto Univ., Kumamoto
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    1097
  • Lastpage
    1102
  • Abstract
    In the coexistence circumstance with humans and robots, sensory and emotional feeling of human should be considered when the robots interact to human. A typical unpleasant feeling at interaction is pain. One approach for construction of safety coexistence circumstance with humans is to design the autonomous robot with action learning ability based on the subjective pain. In previous researches, a superficial pain model caused by impact has been studied and the transmission mechanism focused on the input-output relations was proposed. However, the generation mechanism of the pain has not been clarified yet. In this paper, a new slow pain model is proposed considering the laminated structure of skin. It is clarified that the strain energy density (SED) is related to the subjective pain level by FEM simulations. From the experimental results, it is confirmed that proposed model is effective for simulation of the subjective pain.
  • Keywords
    finite element analysis; human-robot interaction; mobile robots; skin; FEM simulations; autonomous robot design; emotional feeling; human-robot interaction; humans; pain generation model; sensory feeling; skin; slow pain model; strain energy density; subjective pain; upper limb; Biological system modeling; Capacitive sensors; Human robot interaction; Orbital robotics; Pain; Robot control; Robot sensing systems; Robotics and automation; Safety; Skin; deformation; laminated structure; pain model; skin; strain energy density;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Systems, Man and Cybernetics, 2008. SMC 2008. IEEE International Conference on
  • Conference_Location
    Singapore
  • ISSN
    1062-922X
  • Print_ISBN
    978-1-4244-2383-5
  • Electronic_ISBN
    1062-922X
  • Type

    conf

  • DOI
    10.1109/ICSMC.2008.4811428
  • Filename
    4811428