Advanced multichip module packaging of microelectromechanical systems

Author

Butler, Jeffrey T. ; Bright, Victor M. ; Comtois, John H.

Author_Institution

Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA

Volume

1

fYear

1997

fDate

16-19 Jun 1997

Firstpage

261

Abstract

Multichip module (MCM) packaging provides an efficient solution to integration of MEMS with microelectronics. In this paper, new methods of packaging MEMS using two advanced MCM foundry processes are described. A special purpose surface micromachined MEMS packaging test chip was designed and fabricated. The MEMS test die was packaged with CMOS electronics die using the “chips first” General Electric high density interconnect (HDI) technology and the Micro Module System MCM-D process

Keywords

CMOS integrated circuits; integrated circuit interconnections; integrated circuit packaging; micromachining; micromechanical devices; multichip modules; CMOS electronics die; MCM-D process; MEMS; advanced MCM foundry processes; high density interconnect; microelectromechanical systems; multichip module packaging; surface micromachining; test die; Circuit testing; Electronics packaging; Foundries; Integrated circuit interconnections; Integrated circuit packaging; Microelectromechanical systems; Microelectronics; Micromechanical devices; Monitoring; Multichip modules;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Sensors and Actuators, 1997. TRANSDUCERS '97 Chicago., 1997 International Conference on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-3829-4

Type

conf

DOI

10.1109/SENSOR.1997.613633

Filename

613633