Title :
Trouble-shooting: a key to process improvement
Author :
Yau, Chi W. ; Chang, Song-Lin ; Jordan, Bruce F. ; Schwermann, Joe J. ; Wellman, Joan A.
Author_Institution :
AT&T Eng. Res. Center, Princeton, NJ, USA
Abstract :
The authors present a problem-solving methodology that consists of four basic steps-collecting data, identifying problems, uncovering root causes, and taking action. With the recent advance in computer-integrated manufacturing (CIM), endeavors to improve the process have been greatly eased by the deployment of such systems as ILIAD and MPCS. It is described how some of the tools provided by these systems have been successfully used to carry out the methodology steps in process improvement. For clarification, two case studies conducted on a CIM line are presented. The first deals with reducing test-repair cycles; the second is aimed at yield improvement. A methodology is described that is aimed at reducing the manufacturing cost in general, and the trouble-shooting cost in particular. It is argued that trouble-shooting and yield are closely related, i.e. superior trouble-shooting capability is the prerequisite to process, or yield improvement, and that increased yield necessarily results in decreased repair cost
Keywords :
CAD/CAM; automatic testing; economics; integrated circuit testing; printed circuit testing; production testing; software packages; CIM; IC testing; ILIAD; MPCS; case studies; computer-integrated manufacturing; failure mode analysis; manufacturing cost; production testing; repair cost; test-repair cycles; trouble-shooting cost; yield improvement; Cities and towns; Computer aided manufacturing; Computer integrated manufacturing; Costs; Failure analysis; Feedback; Manufacturing processes; Problem-solving; Stress; Testing;
Conference_Titel :
Test Conference, 1988. Proceedings. New Frontiers in Testing, International
Conference_Location :
Washington, DC
Print_ISBN :
0-8186-0870-6
DOI :
10.1109/TEST.1988.207866
