• DocumentCode
    3112592
  • Title

    Distribution of ion implanted dopants in gallium nitride

  • Author

    Wenzel, A. ; Karl, Holger ; Chang Liu

  • Author_Institution
    Inst. fur Phys., Augsburg Univ.
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    99
  • Lastpage
    102
  • Abstract
    Wurtzitic gallium nitride (GaN) films were implanted with mainly Mg but also with Si, C, and O ions under different conditions (energy, dose, implantation angle, ion-charge state). The resulting depth distributions were analyzed by secondary ion mass spectroscopy (SIMS). The implantation depth profiles and the damage profiles, investigated by Rutherford backscattering-spectroscopy/channeling, are in good agreement with Monte-Carlo simulations. Mg-implantation in the [0001]-channeling direction of GaN resulted in a doubling of the mean projected range of the ions. In addition, the SIMS-detection limit for the different elements was determined
  • Keywords
    III-V semiconductors; Monte Carlo methods; Rutherford backscattering; carbon; channelling; doping profiles; energy loss of particles; gallium compounds; ion implantation; magnesium; oxygen; secondary ion mass spectra; semiconductor thin films; silicon; wide band gap semiconductors; C; GaN films; GaN:Mg,Si,C,O; Mg; Monte-Carlo simulation; O; Rutherford backscattering-spectroscopy/channeling; SIMS; SIMS-detection limit; Si; [0001]-channeling direction; damage profiles; depth distributions; dose; energy; gallium nitride; implantation angle; implantation depth profiles; ion implanted dopants; ion-charge state; mean projected range; secondary ion mass spectroscopy; wurtzite gallium nitride; Backscatter; Doping; Gallium nitride; III-V semiconductor materials; Ion implantation; Mass spectroscopy; Molecular beam epitaxial growth; Pollution measurement; Semiconductor films; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology, 2000. Conference on
  • Conference_Location
    Alpbach
  • Print_ISBN
    0-7803-6462-7
  • Type

    conf

  • DOI
    10.1109/.2000.924100
  • Filename
    924100