DocumentCode
3112811
Title
The effect of a table on the thermal performance of an electronic system
Author
Neelakantan, Sriram ; Addison, Steve
Author_Institution
Flomerics Inc., Marlborough, MA, USA
fYear
1998
fDate
10-12 Mar 1998
Firstpage
16
Lastpage
23
Abstract
This paper describes a computational and analytical study to investigate the effect of the table boundary conditions on the thermal performance of a generic electronics box. The box, a simplified model of a typical laptop computer configuration, has been used to examine the effect of varying table conductivity, air gap thickness, and radiative heat transfer over the limits that would be likely to be found in practical situations. It is shown that, far from being an adiabatic boundary condition, typical tables are much closer to being isothermal heat sinks than one might imagine. It is also shown that, within a practical range, the thickness of the air gap has relatively little effect on the temperature of components within the box. Finally, advice is offered to designers faced with analysis of products in this configuration
Keywords
cooling; design engineering; heat radiation; heat sinks; packaging; thermal analysis; thermal conductivity; air gap thickness; component temperature; electronic system; generic electronics box; isothermal heat sinks; radiative heat transfer; simplified laptop computer configuration model; table boundary conditions; table conductivity; table effects; thermal performance; Boundary conditions; Conductivity; Cooling; Disk drives; Electronic equipment testing; Heat transfer; Plastics; Portable computers; Power dissipation; Product design;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
Conference_Location
San Diego, CA
ISSN
1065-2221
Print_ISBN
0-7803-4486-3
Type
conf
DOI
10.1109/STHERM.1998.660382
Filename
660382
Link To Document