DocumentCode :
3112811
Title :
The effect of a table on the thermal performance of an electronic system
Author :
Neelakantan, Sriram ; Addison, Steve
Author_Institution :
Flomerics Inc., Marlborough, MA, USA
fYear :
1998
fDate :
10-12 Mar 1998
Firstpage :
16
Lastpage :
23
Abstract :
This paper describes a computational and analytical study to investigate the effect of the table boundary conditions on the thermal performance of a generic electronics box. The box, a simplified model of a typical laptop computer configuration, has been used to examine the effect of varying table conductivity, air gap thickness, and radiative heat transfer over the limits that would be likely to be found in practical situations. It is shown that, far from being an adiabatic boundary condition, typical tables are much closer to being isothermal heat sinks than one might imagine. It is also shown that, within a practical range, the thickness of the air gap has relatively little effect on the temperature of components within the box. Finally, advice is offered to designers faced with analysis of products in this configuration
Keywords :
cooling; design engineering; heat radiation; heat sinks; packaging; thermal analysis; thermal conductivity; air gap thickness; component temperature; electronic system; generic electronics box; isothermal heat sinks; radiative heat transfer; simplified laptop computer configuration model; table boundary conditions; table conductivity; table effects; thermal performance; Boundary conditions; Conductivity; Cooling; Disk drives; Electronic equipment testing; Heat transfer; Plastics; Portable computers; Power dissipation; Product design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
Conference_Location :
San Diego, CA
ISSN :
1065-2221
Print_ISBN :
0-7803-4486-3
Type :
conf
DOI :
10.1109/STHERM.1998.660382
Filename :
660382
Link To Document :
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