DocumentCode :
3113192
Title :
Process simulator for plasma enhanced sputter deposition system
Author :
Miyagawa, Y. ; Tanaka, Mitsuru ; Nakadate, H. ; Nakao, S. ; Miyagawa, S.
Author_Institution :
Nat. Ind. Res. Inst. of Nagoya, Japan
fYear :
2000
fDate :
2000
Firstpage :
213
Lastpage :
216
Abstract :
“NEPTUNE/Sputter”, a new process simulator for a plasma enhanced sputter deposition system has been developed which includes simulation modules for plasma behavior, the sputtering process, the transport of sputtered particles and the deposition processes. The particle-in-cell (PIC) and the Monte Carlo collision (MCC) approaches have been combined into a PIC-MCC module for self-consistent simulations of low-temperature collisional plasmas and the background gas. This approach is based on the weighting collision simulation scheme allowing for disparate number densities and time scales of different species. The sputtering process induced by energetic ions which incident on the target surface is simulated by the dynamic Monte Carlo module (SASA-sp: the sputtering version of dynamic-SASAMAL code). The transport of sputtered particles is simulated by the direct simulation Monte Carlo module (DSMC) considering sputtered particles as neutrals. Some results obtained for a DC magnetron sputter deposition system such as plasma behavior, time evolution of sputtered particle distribution in the plasma, the thickness fluctuation of the deposited film, etc. are presented
Keywords :
Monte Carlo methods; plasma simulation; sputter deposition; sputtering; Monte Carlo collision; NEPTUNE/Sputter; SASA-sp; background gas; deposition processes; direct simulation Monte Carlo module; disparate number densities; dynamic Monte Carlo module; low-temperature collisional plasmas; particle-in-cell; plasma behavior; plasma enhanced sputter deposition system; process simulator; self-consistent simulations; simulation modules; sputtered particle distribution; sputtering process; thickness fluctuation; time evolution; time scales; weighting collision simulation scheme; Electric potential; Electrodes; Magnetic fields; Monte Carlo methods; Plasma applications; Plasma density; Plasma simulation; Plasma temperature; Plasma transport processes; Sputtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology, 2000. Conference on
Conference_Location :
Alpbach
Print_ISBN :
0-7803-6462-7
Type :
conf
DOI :
10.1109/.2000.924127
Filename :
924127
Link To Document :
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