• DocumentCode
    3113801
  • Title

    The Use of Spreadsheets in Packaging Thermal Calculations

  • Author

    Guenin, Bruce M.

  • Author_Institution
    Amkor Electronics, Inc.
  • fYear
    1998
  • fDate
    10-12 Mar 1998
  • Firstpage
    55
  • Lastpage
    56
  • Keywords
    Computer languages; Dielectrics; Electronic packaging thermal management; Integrated circuit packaging; Physics; Plastic packaging; Resistance heating; Thermal conductivity; Thermal force; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-4486-3
  • Type

    conf

  • DOI
    10.1109/STHERM.1998.660387
  • Filename
    660387
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3113801