DocumentCode :
3113801
Title :
The Use of Spreadsheets in Packaging Thermal Calculations
Author :
Guenin, Bruce M.
Author_Institution :
Amkor Electronics, Inc.
fYear :
1998
fDate :
10-12 Mar 1998
Firstpage :
55
Lastpage :
56
Keywords :
Computer languages; Dielectrics; Electronic packaging thermal management; Integrated circuit packaging; Physics; Plastic packaging; Resistance heating; Thermal conductivity; Thermal force; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
ISSN :
1065-2221
Print_ISBN :
0-7803-4486-3
Type :
conf
DOI :
10.1109/STHERM.1998.660387
Filename :
660387
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3113801
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