DocumentCode
3113928
Title
New design of a decelerator module for ultra low energy implantation
Author
BenAssayag, G. ; Sant, W. ; Olivie, F. ; Seguela, A. ; Armand, C. ; Voillot, F. ; Claverie, A.
Author_Institution
CEMES, CNRS, Toulouse, France
fYear
2000
fDate
2000
Firstpage
384
Lastpage
387
Abstract
A new decelerator system has been successfully designed, fabricated and tested. This module can extend the energy range of any ion implanter down to 0.6 keV by simply replacing the end station. Boron profiles implanted either into preamorphized or crystalline silicon exhibit excellent characteristics. P+/n junctions with depth smaller than 50 nm are obtained after activation annealing. An amount of non-decelerated neutral atoms smaller than about 0.2% is measured. A sheet resistivity of 710 Ω/□ and a good uniformity of about 9% are extracted. These results make this module attractive for developers involved in testing future devices and after improvement, could be used for low throughput production and R&D at low cost
Keywords
amorphous semiconductors; annealing; beam handling equipment; boron; doping profiles; electrical resistivity; elemental semiconductors; ion implantation; p-n junctions; semiconductor doping; silicon; 50 nm; Si:B; activation annealing; boron profiles; crystalline silicon; decelerator module; design; end station; energy range; ion implanter; nondecelerated neutral atoms; p+/n junctions; preamorphized silicon; sheet resistivity; ultra low energy implantation; uniformity; Annealing; Atomic measurements; Boron; Conductivity; Costs; Crystallization; Production; Silicon; System testing; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology, 2000. Conference on
Conference_Location
Alpbach
Print_ISBN
0-7803-6462-7
Type
conf
DOI
10.1109/.2000.924168
Filename
924168
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