• DocumentCode
    3113928
  • Title

    New design of a decelerator module for ultra low energy implantation

  • Author

    BenAssayag, G. ; Sant, W. ; Olivie, F. ; Seguela, A. ; Armand, C. ; Voillot, F. ; Claverie, A.

  • Author_Institution
    CEMES, CNRS, Toulouse, France
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    384
  • Lastpage
    387
  • Abstract
    A new decelerator system has been successfully designed, fabricated and tested. This module can extend the energy range of any ion implanter down to 0.6 keV by simply replacing the end station. Boron profiles implanted either into preamorphized or crystalline silicon exhibit excellent characteristics. P+/n junctions with depth smaller than 50 nm are obtained after activation annealing. An amount of non-decelerated neutral atoms smaller than about 0.2% is measured. A sheet resistivity of 710 Ω/□ and a good uniformity of about 9% are extracted. These results make this module attractive for developers involved in testing future devices and after improvement, could be used for low throughput production and R&D at low cost
  • Keywords
    amorphous semiconductors; annealing; beam handling equipment; boron; doping profiles; electrical resistivity; elemental semiconductors; ion implantation; p-n junctions; semiconductor doping; silicon; 50 nm; Si:B; activation annealing; boron profiles; crystalline silicon; decelerator module; design; end station; energy range; ion implanter; nondecelerated neutral atoms; p+/n junctions; preamorphized silicon; sheet resistivity; ultra low energy implantation; uniformity; Annealing; Atomic measurements; Boron; Conductivity; Costs; Crystallization; Production; Silicon; System testing; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology, 2000. Conference on
  • Conference_Location
    Alpbach
  • Print_ISBN
    0-7803-6462-7
  • Type

    conf

  • DOI
    10.1109/.2000.924168
  • Filename
    924168