DocumentCode
3114002
Title
Multimodal circuit model for the analysis of asymmetric shunt impedance transitions
Author
Rodriguez-Cepeda, Pablo ; Ribó, Miquel ; Pajares, Francisco-Javier ; Regué, Joan-Ramon ; Sánchez, Albert-Miquel ; Pérez, Antonio
Author_Institution
GRECO, Univ. Ramon Llull, Barcelona
fYear
2008
fDate
18-22 Aug. 2008
Firstpage
1
Lastpage
5
Abstract
In PCB circuits, signal traces are often routed close to other signal traces. This situation originates the appearance of coupled strip sections. Due to the fact that coupled strip sections behave as multimodal transmission lines, several electromagnetic modes propagate simultaneously. Any asymmetry in the circuit will generate an energy exchange among the propagating modes which will lead to signal integrity problems. In this paper, a new multimodal circuit model for a Three-Line-Microstrip Asymmetric Shunt Impedance Transition is presented. The model allows a rigorous and a quantitative analysis of the transition. The model is successfully applied to the analysis of a PCB configuration where a clock signal trace is routed close to two other signal traces. The good agreement between measurements and circuit simulations validates the proposed multimodal circuit model.
Keywords
circuit simulation; microstrip lines; printed circuit design; transmission lines; PCB circuit design; PCB routing; circuit simulations; clock signal trace; coupled strip sections; electromagnetic mode propagation; energy exchange; multimodal circuit model; multimodal transmission lines; three-line-microstrip asymmetric shunt impedance transition; Clocks; Coupling circuits; Distributed parameter circuits; Electromagnetic coupling; Electromagnetic propagation; Energy exchange; Impedance; Signal analysis; Signal generators; Strips; PCB routing; asymmetric shunt impedance; clock signal trace; coupled-strip sections; multiomodal transmission line; mutimodal circuit model; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location
Detroit, MI
Print_ISBN
978-1-4244-1699-8
Electronic_ISBN
978-1-4244-1698-1
Type
conf
DOI
10.1109/ISEMC.2008.4652056
Filename
4652056
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