Title :
Digital to RF coupling analysis methodology for mixed-signal systems
Author :
Lim, Dongsoon ; Yongsup Kim ; Kim, Yongsup
Author_Institution :
Samsung Electron. Co., Ltd., Suwon
Abstract :
Digital harmonics could be coupled to a RF system in a digital & RF mixed signal board or a package. The coupled digital harmonic could reduce the RF sensitivity of the system, or cause a system failure. Digital to RF coupling is the most important factor of degrading mixed-signal systems. The analysis methodology of evaluating the RF performance reflected by the digital harmonics is addressed. In this paper, proposed methodology has been applied to RF receiver hardware and verified by 3D electromagnetic simulation.
Keywords :
couplings; failure analysis; harmonic analysis; sensitivity analysis; system-in-package; 3D electromagnetic simulation; RF coupling analysis methodology; RF receiver hardware; RF sensitivity; digital coupling analysis methodology; digital harmonics; mixed-signal systems; system failure; system-in-package; Degradation; Frequency domain analysis; Harmonic analysis; Mobile handsets; Modems; Packaging; RF signals; Radio frequency; Signal analysis; Time domain analysis; RF sensitivity; System-in-Package (SiP); coupled noise; harmonic;
Conference_Titel :
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4244-1699-8
Electronic_ISBN :
978-1-4244-1698-1
DOI :
10.1109/ISEMC.2008.4652067
