Experimental evaluation of elliptical fin heat sinks for enhanced PBGA packages

Author

Çelik, Zeki Z.

Author_Institution

LSI Logic Corp., Fremont, CA, USA

fYear

1998

fDate

10-12 Mar 1998

Firstpage

63

Lastpage

67

Abstract

Elliptical fin heat sinks with different fin heights and base areas were selected for experimental evaluation with 45 mm×45 mm enhanced plastic ball grid array (EPBGA) packages. They were tested to determine the thermal enhancement in terms of junction-to-air thermal resistance at velocities ranging from 0 m/s to 3 m/s in the LSI closed circuit wind tunnel. It was observed that the maximum variation in junction-to-air resistance is a function of fin height and heat sink base area as well as air velocity. Thermal performance was greatly affected by the orientation of heat sinks with the same surface area. Empirical equations which predict the loci of maximum variation for a given base area were developed

Keywords

heat sinks; integrated circuit packaging; integrated circuit testing; plastic packaging; thermal analysis; thermal resistance; 0 to 3 m/s; 45 mm; air velocity; closed circuit wind tunnel; elliptical fin heat sinks; enhanced PBGA packages; enhanced plastic ball grid array packages; fin height; heat sink base area; heat sink orientation; heat sink surface area; junction-to-air thermal resistance; thermal enhancement; thermal performance; Circuit testing; Electronics packaging; Heat sinks; Large scale integration; Logic arrays; Plastic packaging; Temperature measurement; Temperature sensors; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE

Conference_Location

San Diego, CA

ISSN

1065-2221

Print_ISBN

0-7803-4486-3

Type

conf

DOI

10.1109/STHERM.1998.660389

Filename

660389