Modeling of the substrate coupling path for direct power injection in integrated circuits

This paper presents a substrate coupling path model for the direct power injection (DPI) of EMI disturbances into the substrate of an integrated circuit (IC). This modeling is achieved on a 0.18 mum test chip composed of several functionally identical cores, differing only by their EMI protection strategies (RC protection, isolated substrate), and takes into account these different strategies. The comparison between simulation results and related measurements demonstrates that, once combined with the complete model of the injection set-up itself, these models are helpful to choose the best protection strategy against electromagnetic disturbances.