DocumentCode
3114552
Title
Implant dosimetry results for plasma doping
Author
Walther, Steve ; Lenoble, Damien ; Fang, Ziwei ; Liebert, Reuel B.
Author_Institution
Varian Semicond. Equip. Assoc. Inc., Gloucester, MA, USA
fYear
2000
fDate
2000
Firstpage
492
Lastpage
495
Abstract
A system for accurate and repeatable implant dose measurement for plasma doping architectures must circumvent a number of possible pitfalls. Such a system must accurately count ions crossing the pulsed plasma sheath to the wafer surface, while that surface is typically at high potential and immersed in the ambient plasma environment of the wafer. The effects of secondary electrons and the capacitive displacement current must be suppressed and the measurement itself must not alter the plasma or be affected by the high potential of the wafer bias. Traditional Faraday systems do not address these requirements. A new dose measurement system has been developed to meet the needs of pulsed plasma doping and the performance of that system for dose accuracy, repeatability, and uniformity is described
Keywords
dosimetry; ion implantation; plasma diagnostics; plasma materials processing; capacitive displacement current; dose accuracy; high potential; implant dose measurement; implant dosimetry; measurement system performance; plasma doping; pulsed plasma sheath; repeatability; secondary electrons; uniformity; wafer surface; Current measurement; Displacement measurement; Doping; Dosimetry; Electrons; Implants; Plasma immersion ion implantation; Plasma measurements; Plasma sheaths; Pulse measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology, 2000. Conference on
Conference_Location
Alpbach
Print_ISBN
0-7803-6462-7
Type
conf
DOI
10.1109/.2000.924195
Filename
924195
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