DocumentCode :
3114552
Title :
Implant dosimetry results for plasma doping
Author :
Walther, Steve ; Lenoble, Damien ; Fang, Ziwei ; Liebert, Reuel B.
Author_Institution :
Varian Semicond. Equip. Assoc. Inc., Gloucester, MA, USA
fYear :
2000
fDate :
2000
Firstpage :
492
Lastpage :
495
Abstract :
A system for accurate and repeatable implant dose measurement for plasma doping architectures must circumvent a number of possible pitfalls. Such a system must accurately count ions crossing the pulsed plasma sheath to the wafer surface, while that surface is typically at high potential and immersed in the ambient plasma environment of the wafer. The effects of secondary electrons and the capacitive displacement current must be suppressed and the measurement itself must not alter the plasma or be affected by the high potential of the wafer bias. Traditional Faraday systems do not address these requirements. A new dose measurement system has been developed to meet the needs of pulsed plasma doping and the performance of that system for dose accuracy, repeatability, and uniformity is described
Keywords :
dosimetry; ion implantation; plasma diagnostics; plasma materials processing; capacitive displacement current; dose accuracy; high potential; implant dose measurement; implant dosimetry; measurement system performance; plasma doping; pulsed plasma sheath; repeatability; secondary electrons; uniformity; wafer surface; Current measurement; Displacement measurement; Doping; Dosimetry; Electrons; Implants; Plasma immersion ion implantation; Plasma measurements; Plasma sheaths; Pulse measurements;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology, 2000. Conference on
Conference_Location :
Alpbach
Print_ISBN :
0-7803-6462-7
Type :
conf
DOI :
10.1109/.2000.924195
Filename :
924195
Link To Document :
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