Title :
Radiated emission of bent microstrip line using Hertzian dipole method
Author :
Khee, Yee See ; Jenu, Mohd Zarar Mohd
Author_Institution :
Dept. of Commun. Eng., Univ. Tun Hussein Onn Malaysia, Batu Pahat
Abstract :
Electromagnetic Interference (EMI) and Signal Integrity (SI) issues have generated challenges to the high speed digital circuit designer as the operating clock frequency of the system continue to increase to accommodate broadband applications. Discontinuity due to microstrip bents which appear frequently in most VLSI design requires thorough understanding on the current distribution in order to generate the immunity and emission characteristic of the circuit. In this paper, the focus will be on the bent microstrip transmission line based on the forward-backward travelling wave mode method (TWM) by Xilei Liu et. al. Their approach will be modified with the adoption of equivalent wire model to suit for the case of microstrip line. The expanded Hertzian dipole formulations were then used to determine the inadmissible radiated emission that annoys the external circuits. Computer simulation using MICROWAVE STUDIOreg will be implemented for validation of the modelling technique.
Keywords :
VLSI; electromagnetic interference; integrated circuit design; microstrip discontinuities; transmission lines; Hertzian dipole method; TWM; VLSI design; broadband applications; electromagnetic interference; equivalent wire model; forward-backward travelling wave mode method; high speed digital circuit design; microstrip line bent; radiated emission; signal integrity; Clocks; Current distribution; Digital circuits; Electromagnetic interference; Frequency; Microstrip; Signal design; Signal generators; Transmission line discontinuities; Very large scale integration; Hertzian Dipole; Microstrip Line; Radiated Emission; Travelling Wave Mode Method;
Conference_Titel :
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4244-1699-8
Electronic_ISBN :
978-1-4244-1698-1
DOI :
10.1109/ISEMC.2008.4652086