• DocumentCode
    3114875
  • Title

    Implant charging dependence on photo resist bake and electron flood gun

  • Author

    Romig, Terry ; Chao, King ; Rendon, Michael J. ; Azrack, Marijean

  • Author_Institution
    Motorola Inc., Austin, TX, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    558
  • Lastpage
    560
  • Abstract
    Some ASIC parts in the 0.5 μm range experienced severe yield loss due to implant charging issues during the source/drain extension implant. The failing dice were in a circular pattern. The edge intensive poly over gate oxide test structures showed depressed breakdown voltages while other gate oxide integrity structures were not affected. Photo resist out-gassing induced vacuum related holds had strong correlation to reduced yield and depressed breakdown voltages. Replacing the forward biased electron shower with the newer reverse biased electron shower showed improved yield while the optimization of the photo resist UV bake eliminated the vacuum related holds
  • Keywords
    application specific integrated circuits; electric breakdown; electron guns; electron-surface impact; failure analysis; integrated circuit reliability; integrated circuit testing; integrated circuit yield; ion implantation; outgassing; photoresists; semiconductor device breakdown; semiconductor doping; surface charging; 0.5 mum; ASIC parts; breakdown voltages; circular pattern; depressed breakdown voltages; edge intensive poly over gate oxide test structures; electron flood gun; failing dice; forward biased electron shower; gate oxide integrity structures; implant charging; photo resist UV bake; photo resist bake; photoresist out-gassing; reduced yield; reverse biased electron shower; source/drain extension implant; vacuum related holds; yield loss; Application specific integrated circuits; Chaos; Electron beams; Electron tubes; Floods; Implants; Potential well; Resists; Testing; Vacuum breakdown;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology, 2000. Conference on
  • Conference_Location
    Alpbach
  • Print_ISBN
    0-7803-6462-7
  • Type

    conf

  • DOI
    10.1109/.2000.924213
  • Filename
    924213