• DocumentCode
    3114881
  • Title

    Defining and assessing the uncertainty contributions in the line-injection measurements of transfer impedance

  • Author

    Carobbi, Carlo ; Cati, Marco ; Panconi, Carlo

  • Author_Institution
    Univ. di Firenze, Florence
  • fYear
    2008
  • fDate
    18-22 Aug. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The shielding effectiveness of the coaxial transmission lines is currently quantified in terms of transfer impedance, a lumped-element concept. Its measurement is based on two methods, the more recent of which, the line injection method, is intended to extend the technique to higher frequencies. In doing so, wave propagation effects are introduced which produce potential distortion of the quantity we intend to observe. Also, the test arrangement is imperfectly grounded, thus unpredictable common-mode coupling may be present. This paper describes the approximations of the basic equations involved and the uncertainties related to the experimental equipment. A configuration of the injection line intended to minimize common-mode effects, and improve the predictability and repeatability is adopted. An experimental verification based on the comparison with the traditional and more closely defined method of the triaxial coupler is offered.
  • Keywords
    coaxial cables; electromagnetic shielding; transmission lines; wave propagation; coaxial transmission lines; common-mode coupling; line injection method; line-injection measurements; lumped-element concept; shielding effectiveness; transfer impedance; triaxial coupler; uncertainty contributions assessment; wave propagation effects; Coaxial components; Conductors; Equations; Frequency; Impedance measurement; Magnetic shielding; Testing; Transmission line measurements; Transmission line theory; Voltage; Transfer impedance; line-injection method; measurement uncertainty; triaxial method;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4244-1699-8
  • Electronic_ISBN
    978-1-4244-1698-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2008.4652097
  • Filename
    4652097