DocumentCode :
3115003
Title :
Impact of thermal stress on the characteristics of conducted emissions
Author :
Montanari, I. ; Tacchini, A. ; Maini, M.
Author_Institution :
Dept. of Sci. & Methods for Eng., Univ. of Modena & Reggio Emilia, Modena
fYear :
2008
fDate :
18-22 Aug. 2008
Firstpage :
1
Lastpage :
4
Abstract :
This work presents and discusses the results of a measurement campaign aimed at demonstrating the influence of aging on the spectrum produced by an electronic device. The evaluations evidence a high spectrum sensibility to the aging, which can be used for apparatus monitoring, but the electromagnetic signature, although modified, remains identifiable. The results presented refer to an extensive measurements campaign aimed at verifying the influence of thermal cycles, used to simulate the aging, on the spectral signature of a device, in order to evaluate its modification and to identify the device by signature.
Keywords :
ageing; electromagnetic compatibility; thermal stresses; apparatus monitoring; conducted emissions; electromagnetic signature; electronic device; spectral signature; spectrum sensibility; thermal cycles; thermal stress; Aging; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic measurements; Manufacturing; Performance evaluation; Power measurement; Power supplies; Thermal conductivity; Thermal stresses;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
978-1-4244-1699-8
Electronic_ISBN :
978-1-4244-1698-1
Type :
conf
DOI :
10.1109/ISEMC.2008.4652103
Filename :
4652103
Link To Document :
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