• DocumentCode
    3115166
  • Title

    SIMS quantification round-robin study at Evans analytical group

  • Author

    Smith, Stephen P. ; Bleiler, R. ; Buyuklimanli, T. ; Biswas, S.

  • Author_Institution
    Evans Anal. Group, Charles Evans & Associates, Sunnyvale, CA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    631
  • Lastpage
    634
  • Abstract
    Bulk-doped silicon wafers were measured at four EAG (Evans Analytical Group) site laboratories in a round-robin study of the calibration of SIMS measurements of dopant concentrations in silicon. Mean B, P, and As concentrations were determined for several bulk-doped silicon reference wafers. Absolute concentration calibration scales are determined by NIST Standard Reference Materials (B, As) or accepted Consensus Reference Materials (P). At any single EAG measurement site, the average repeatibility of an individual dopant concentration measurement was about 0.7% for B, 2.1% for P, and 2.3% for As. Across the four sites, the best reproducibility for concentration measurements was found when bulk-doped standards were used for calibration. Average reproducibility of dopant concentration measurements across the EAG was 0.9% for B, 2.5% for P, and 2.6% for As
  • Keywords
    arsenic; boron; calibration; chemical analysis; elemental semiconductors; ion implantation; phosphorus; secondary ion mass spectra; secondary ion mass spectroscopy; semiconductor doping; silicon; Evans analytical group; SIMS quantification; Si; Si:As; Si:B; Si:P; average repeatibility; bulk-doped reference wafers; calibration; dopant concentration measurement; ion implantation; measurement site; reproducibility; round-robin study; Calibration; Implants; Instruments; Laboratories; Magnetic analysis; Measurement standards; NIST; Q measurement; Reproducibility of results; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology, 2000. Conference on
  • Conference_Location
    Alpbach
  • Print_ISBN
    0-7803-6462-7
  • Type

    conf

  • DOI
    10.1109/.2000.924232
  • Filename
    924232