• DocumentCode
    3115235
  • Title

    Assessing the performance of ZigBee in a reverberant environment using a mode stirred chamber

  • Author

    Hope, David ; Dawson, John ; Marvin, Andy ; Panitz, Mark ; Christopoulos, Christos ; Sewell, Philip

  • Author_Institution
    Dept. of Electron., Univ. of York, York
  • fYear
    2008
  • fDate
    18-22 Aug. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    The application of ZigBee networks to highly reverberant environments has been investigated using a reverberation chamber. Different Q-factors were set up, by loading the reverberation chamber, and the performance of a COTS ZigBee system was recorded . It has been found that the ZigBee system tested is capable of working in highly reverberant environments and is only seriously limited for a value of Q-factor above 5000, which is greater than that which would typically be encountered outside of a laboratory. The packet error rate (PER) was generally found to be very low for Q-factors between 1000 and 5000, with the possibility a high PER for some combinations of stirrer and antenna positions. With a Q of below 1000 the transceivers were found to work with a PER below 1% regardless of antenna and stirrer positions and the corresponding fading is nearly flat over a data symbolpsilas bandwidth. Radio performance is presented in terms of the packet error rate and this is related to the measured and simulated channel impulse response.
  • Keywords
    Q-factor; error statistics; personal area networks; transient response; wireless sensor networks; Q-factor; ZigBee networks; ZigBee system; antenna positions; channel impulse response; data symbol bandwidth; mode stirred chamber; packet error rate; reverberant environment; Aerospace electronics; Continuous phase modulation; Error analysis; Physical layer; Pulse modulation; Q factor; Reverberation chamber; Spread spectrum communication; Wireless sensor networks; ZigBee;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4244-1699-8
  • Electronic_ISBN
    978-1-4244-1698-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2008.4652116
  • Filename
    4652116