Noise coupling between signal and power/ground nets due to signal vias transitioning through power/ground plane pair

Author

Fan, Jun ; Cocchini, Matteo ; Archambeault, Bruce ; Knighten, James L. ; Drewniak, James L. ; Connor, Samuel

Author_Institution

UMR/MS & T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO

fYear

2008

fDate

18-22 Aug. 2008

Firstpage

1

Lastpage

5

Abstract

Signal vias are often used to move a signal from one PCB layer to another. As a result, these vias can penetrate power/ground plane pair and cause noise coupling (crosstalk) between signal and power/ground nets. This paper studies the noise coupling mechanism using a segmentation approach combined with a via capacitance model and a plane-pair cavity model. Noise coupling from signal to power/ground, and vice versa, is demonstrated in the modeling results.

Keywords

capacitance; crosstalk; printed circuits; signal processing equipment; PCB layer; capacitance model; crosstalk; noise coupling; power/ground nets; power/ground plane pair; segmentation approach; signal nets; signal vias transitioning; Capacitance; Capacitors; Coupling circuits; Crosstalk; Equivalent circuits; Frequency; Geometry; Impedance; Integrated circuit modeling; Voltage; Noise coupling; cavity model; signal and power/ground nets; signal via transition; via capacitance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on

Conference_Location

Detroit, MI

Print_ISBN

978-1-4244-1699-8

Electronic_ISBN

978-1-4244-1698-1

Type

conf

DOI

10.1109/ISEMC.2008.4652117

Filename

4652117