DocumentCode
3115683
Title
Link path design on a block-by-block basis
Author
De Paulis, Francesco ; Fan, Jun ; Diepenbrock, Jay ; Archambeault, Bruce ; Connor, Samuel ; Orlandi, Antonio
Author_Institution
EMCLab, Missouri Univ. of Sci. & Technol., Rolla, MO
fYear
2008
fDate
18-22 Aug. 2008
Firstpage
1
Lastpage
6
Abstract
In high-speed data communication systems, the complexity of link path between transmitters and receivers present a challenge for designers to maintain an acceptable bit error rate. An approach is presented in this paper to design the link path on a block-by-block basis. The unique advantage of this approach lies on the physics-based model of each block, which relates performance to geometry and makes design improvement and optimization possible. An example link path involving a backpanel is investigated using the approach. The via stubs and the dielectric materials in the backpanel are demonstrated to be critical factors for link performance in certain situations.
Keywords
data communication; radio receivers; radio transmitters; telecommunication links; bit error rate; block by block basis; high speed data communication systems; link path design; receivers; transmitters; Costs; Dielectric materials; Frequency domain analysis; Geometry; Jitter; Scattering parameters; Signal analysis; Signal design; Signal generators; Solid modeling; backpanel; block-by-block approach; link path design; via stub;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
Conference_Location
Detroit, MI
Print_ISBN
978-1-4244-1699-8
Electronic_ISBN
978-1-4244-1698-1
Type
conf
DOI
10.1109/ISEMC.2008.4652140
Filename
4652140
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