• DocumentCode
    3116075
  • Title

    Comprehensive material characterization and method of its validation by means of FEM simulation

  • Author

    Gromala, P. ; Duerr, I. ; Dressler, M. ; Jansen, K.M.B. ; Hawryluk, M. ; De Vreugd, I.

  • Author_Institution
    Automotive Electron., Robert Bosch GmbH, Reutlingen, Germany
  • fYear
    2011
  • fDate
    18-20 April 2011
  • Firstpage
    42377
  • Lastpage
    42590
  • Abstract
    Numerical simulation plays an important role in product design. Its accuracy relays on a detailed description of geometry, material models, load and boundary conditions. This paper focuses on a new approach of FEM material modeling of three commercially available molding compounds. Curing shrinkage, modulus of elasticity and coefficient of thermal expansion were measured and implemented into commercially available FEM code Ansys. Fringe pattern technique has been used to measure warpage of bimaterial strips. Then FEM simulation of bimaterial strips were done and compared with experimental results. Curing shrinkage has been modeled in an effective way. Its accuracy has been checked on one of the materials by creating bimaterial strips with three different geometrical dimensions, that is varied thickness of mold and copper substrate.
  • Keywords
    curing; finite element analysis; moulding; substrates; FEM code Ansys; FEM material modeling; FEM simulation; bimaterial strips; boundary condition; coefficient; copper substrate; curing shrinkage; fringe pattern technique; geometry; material characterization; modulus of elasticity; mold substrate; numerical simulation; product design; thermal expansion; warpage; Compounds; Curing; Electromagnetic compatibility; Finite element methods; Heating; Polymers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
  • Conference_Location
    Linz
  • Print_ISBN
    978-1-4577-0107-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2011.5765770
  • Filename
    5765770