DocumentCode :
3116603
Title :
Different approaches for integrating HBTs and EAMs
Author :
Reimann, T. ; Schneider, M. ; Neumann, S. ; Jäger, D. ; Tegude, F.J.
Author_Institution :
Solid-State Electron. Dept., Duisburg Univ., Germany
fYear :
2002
fDate :
18-19 Nov. 2002
Firstpage :
149
Lastpage :
154
Abstract :
We compare three different approaches to combine heterojunction bipolar transistors (HBTs) and electroabsorption waveguide modulators (EAMs) for building monolithically integrated opto-electronic circuits: A single stage HBT-driver is applied to an EAM load where the HBT layer stack is grown onto the EAM-layer structure. This is compared to a merged integration of HBTs and EAMs with the waveguide inside the transistor layers with separate devices, and a merged device called HBT-EAM. The compact layer structure and processing supports the concept of this merged device.
Keywords :
electro-optical modulation; electroabsorption; heterojunction bipolar transistors; integrated circuit design; integrated circuit measurement; integrated optoelectronics; EAM loads; EAM-layer structure; HBT layer stack; HBT-drivers; HBT/EAM integration; electroabsorption waveguide modulators; heterojunction bipolar transistors; integrated optoelectronic circuits; merged integration; optical absorption; Circuits; Heterojunction bipolar transistors; Optical modulation; Optical refraction; Optical variables control; Optical waveguides; Resistors; Stimulated emission; Voltage; Waveguide junctions;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on
Print_ISBN :
0-7803-7530-0
Type :
conf
DOI :
10.1109/EDMO.2002.1174946
Filename :
1174946
Link To Document :
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