DocumentCode
3116857
Title
Generation of reduced thermal models of electronic systems from transient thermal response
Author
Janicki, Marcin ; Zubert, Mariusz ; Napieralski, Andrzej
Author_Institution
Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
fYear
2011
fDate
18-20 April 2011
Firstpage
42373
Lastpage
42464
Abstract
This paper presents a methodology for the creation of reduced thermal models of electronic systems based on the knowledge of the system dynamic temperature response. The registration of thermal responses using equidistant sampling on a logarithmic time scale allows the proper identification of all the time constants in the responses. Knowing the entire time constant spectrum, it is possible to generate a reduced dynamic thermal model in the form of an RC Cauer ladder with a limited number of stages. This simple model assures not only short simulation time and provides excellent accuracy but also allows the identification of certain physical parameters of a system. The methodology is illustrated in the paper based on the example of discrete power devices attached to a heat sink and cooled with forced air flow. The reduced thermal model is suitable for the direct implementation in the SPICE simulator or almost any other multiphysics simulation environment.
Keywords
SPICE; electronics packaging; heat sinks; integrated circuits; thermal analysis; transient response; RC Cauer ladder; SPICE simulator; discrete power device; dynamic temperature response; electronic system; equidistant sampling; forced air flow; heat sink; logarithmic time scale; multiphysics simulation environment; physical parameter; thermal model reduction; transient thermal response; Adaptation model; Atmospheric measurements; Electronic packaging thermal management; Materials; Mathematical model; Temperature measurement; Thermal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location
Linz
Print_ISBN
978-1-4577-0107-8
Type
conf
DOI
10.1109/ESIME.2011.5765808
Filename
5765808
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