• DocumentCode
    3116857
  • Title

    Generation of reduced thermal models of electronic systems from transient thermal response

  • Author

    Janicki, Marcin ; Zubert, Mariusz ; Napieralski, Andrzej

  • Author_Institution
    Dept. of Microelectron. & Comput. Sci., Tech. Univ. of Lodz, Lodz, Poland
  • fYear
    2011
  • fDate
    18-20 April 2011
  • Firstpage
    42373
  • Lastpage
    42464
  • Abstract
    This paper presents a methodology for the creation of reduced thermal models of electronic systems based on the knowledge of the system dynamic temperature response. The registration of thermal responses using equidistant sampling on a logarithmic time scale allows the proper identification of all the time constants in the responses. Knowing the entire time constant spectrum, it is possible to generate a reduced dynamic thermal model in the form of an RC Cauer ladder with a limited number of stages. This simple model assures not only short simulation time and provides excellent accuracy but also allows the identification of certain physical parameters of a system. The methodology is illustrated in the paper based on the example of discrete power devices attached to a heat sink and cooled with forced air flow. The reduced thermal model is suitable for the direct implementation in the SPICE simulator or almost any other multiphysics simulation environment.
  • Keywords
    SPICE; electronics packaging; heat sinks; integrated circuits; thermal analysis; transient response; RC Cauer ladder; SPICE simulator; discrete power device; dynamic temperature response; electronic system; equidistant sampling; forced air flow; heat sink; logarithmic time scale; multiphysics simulation environment; physical parameter; thermal model reduction; transient thermal response; Adaptation model; Atmospheric measurements; Electronic packaging thermal management; Materials; Mathematical model; Temperature measurement; Thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
  • Conference_Location
    Linz
  • Print_ISBN
    978-1-4577-0107-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2011.5765808
  • Filename
    5765808