• DocumentCode
    3116896
  • Title

    Studies on the reliability of power packages based on strength and fracture criteria

  • Author

    Dudek, Rainer ; Pufall, Reinhard ; Seiler, Bettina ; Michel, Bernd

  • Author_Institution
    Micro Mater. Center Chemnitz, Fraunhofer ENAS, Chemnitz, Germany
  • fYear
    2011
  • fDate
    18-20 April 2011
  • Firstpage
    42377
  • Lastpage
    42590
  • Abstract
    Thermal cycling induced failure in power packages has been studied comparing thermal cycling (TC) with thermal shock (TS) tests by thermo-mechanical analyses. The major question for the time reduction is that after the failure mechanism and if it changes with changed loading type and duration. These questions were addressed by theoretical analyses including coupled transient thermal-mechanical analyses and interface fracture mechanics applying the cohesive zone approach. By the latter, critical states for delamination failures could be derived. Finally, critical interface fracture parameters of the package were compared with results from the button shear test.
  • Keywords
    delamination; failure (mechanical); fracture mechanics; mechanical testing; packaging; reliability; thermal stress cracking; thermomechanical treatment; coupled transient thermomechanical analysis; delamination failure; fracture criteria; interface fracture mechanics; power package reliability; strength criteria; thermal cycling induced failure; thermal shock test; Deformable models; Electric shock; Heating; Materials; Stress; Thermal analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
  • Conference_Location
    Linz
  • Print_ISBN
    978-1-4577-0107-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2011.5765810
  • Filename
    5765810