Title :
Microstrip antennas using multi-layer packaging technology
Author :
Schweighofer, A. ; Leitgeb, E. ; Birnbacher, U. ; Weinzerl, B. ; Fluhr, H. ; Leitner, M.
Author_Institution :
Inst. fur Nachrichtentechnik und Wellenausbreitung, Technische Univ. Graz, Austria
Abstract :
This paper presents various microstrip antennas for integration in low-temperature co-fired ceramics (LTCC) technology. The intention was to investigate the characteristics of different antenna concepts. Solutions for increasing the impedance bandwidth and decreasing the size of the antennas were developed. The simulated results of the designed antennas are presented and discussed.
Keywords :
ceramic packaging; finite element analysis; method of moments; microstrip antennas; FEM; LTCC integration; antenna size reduction; finite-element-methods; impedance bandwidth; low-temperature co-fired ceramics multilayer technology; method of moments; microstrip antennas; multi-layer packaging technology; Bandwidth; Ceramics; Dielectric substrates; Feeds; Frequency; Impedance; Microstrip antennas; Nonhomogeneous media; Packaging; Patch antennas;
Conference_Titel :
Electron Devices for Microwave and Optoelectronic Applications, 2002. EDMO 2002. The 10th IEEE International Symposium on
Print_ISBN :
0-7803-7530-0
DOI :
10.1109/EDMO.2002.1174969
