Title :
Thermal performance of tape based ball grid array over molded packages
Author :
Edwards, Darvin ; Hundt, Paul
Author_Institution :
Texas Instrum. Inc., Dallas, TX, USA
Abstract :
A near chip scale package based on area array technology with a tape interposer is thermally evaluated using both computer models and measurement techniques. The package is described and compared to the thermal performance of QFPs with comparable physical dimensions. The thermal performance of the package has been found to be highly dependent upon the arrangement of the solder balls on the interposer and on the die size. The impact of thermal solder balls and underfill is investigated, the contribution of a heat spreader is described, and thermal variation with material composition is studied
Keywords :
assembling; circuit analysis computing; cooling; integrated circuit packaging; integrated circuit testing; soldering; surface mount technology; thermal analysis; QFPs; area array technology; computer models; die size; heat spreader; material composition; measurement techniques; molded packages; near-chip scale package; package physical dimensions; solder ball interposer layout; solder balls; tape based ball grid array; tape interposer; thermal evaluation; thermal performance; thermal solder balls; underfill; Bonding; Chip scale packaging; Electronics packaging; Heat sinks; Instruments; Plastic packaging; Semiconductor device measurement; Testing; Thermal conductivity; Wire;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-4486-3
DOI :
10.1109/STHERM.1998.660403
