Title :
Impact of the solder joint ageing on IGBT I–V characteristics using 2D physical simulations
Author :
Marcault, E. ; Breil, M. ; Bourennane, A. ; Tounsi, P. ; Dupuy, P.
Author_Institution :
LAAS, CNRS, Toulouse, France
Abstract :
Based on 2D mechanical and physical simulations, we explore the impact of solder joint ageing at the origin of power assembly failures, on the electrical characteristics of multi IGBT cells. Electrical characteristics variations are analyzed with the aim of using them for health monitoring of embedded power assemblies.
Keywords :
insulated gate bipolar transistors; solders; 2D physical simulations; IGBT I-V characteristics; electrical characteristics variations; embedded power assemblies; health monitoring; power assembly failures; solder joint ageing; Assembly; Computational modeling; Insulated gate bipolar transistors; Lead; Robustness; Silicon; Stress;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location :
Linz
Print_ISBN :
978-1-4577-0107-8
DOI :
10.1109/ESIME.2011.5765829
