Title :
High temperature hydrogen sensors based on AlGaN/GaN heterostructures
Author :
Song, Junghui ; Flynn, Jeffrey S. ; Brandes, George R. ; Lu, Wu
Author_Institution :
Dept. of Electr. Eng., Ohio State Univ., Columbus, OH, USA
Abstract :
Schottky diodes on AlGaN/GaN heterostructures with Pt, IrPt, and PdAg catalytic metals are fabricated and characterized from 200°C to 800°C for H2 sensing. Over this large range of temperatures, the forward current of all the diodes increases with exposure to H2 gas, which is attributed to Schottky barrier height reduction caused by hydrogen absorption in the catalytic metals. The results indicate that AlGaN/GaN heterostructure Schottky diodes are capable of high temperature H2 sensor operation up to 800°C. As temperature increases, the hydrogen detection sensitivity of Pt and IrPt diodes improves because H2 dissociation is more effective. However, the sensitivity of PdAg diodes degrades with an increase of temperature due to thermal instability of PdAg. At a range of temperatures from 200°C to 300°C, PdAg diodes exhibit significant higher sensitivity compared with Pt and IrPt diodes. Above 400°C, IrPt and Pt diodes show higher sensitivity.
Keywords :
III-V semiconductors; Schottky barriers; Schottky diodes; aluminium compounds; catalysts; dissociation; gallium compounds; gas sensors; hydrogen; iridium alloys; palladium alloys; platinum; platinum alloys; silver alloys; sorption; thermal stability; wide band gap semiconductors; 200 to 800 degC; H2; IrPt-AlGaN-GaN; PdAg-AlGaN-GaN; Pt-AlGaN-GaN; Schottky barrier height reduction; catalytic metal hydrogen absorption; detection sensitivity; dissociation; heterostructure Schottky diodes; high temperature hydrogen sensors; thermal instability; Aluminum gallium nitride; Boolean functions; Data structures; Gallium nitride; Hydrogen; Schottky barriers; Schottky diodes; Sensor phenomena and characterization; Temperature distribution; Temperature sensors;
Conference_Titel :
Sensors, 2004. Proceedings of IEEE
Print_ISBN :
0-7803-8692-2
DOI :
10.1109/ICSENS.2004.1426124