DocumentCode :
311740
Title :
Solid freeform fabrication: novel manufacturing opportunities for electronic ceramics
Author :
Danforth, S.C. ; Safari, A.
Author_Institution :
Dept. of Ceramic Sci. & Eng., Rutgers Univ., Piscataway, NJ, USA
Volume :
1
fYear :
1996
fDate :
18-21 Aug 1996
Firstpage :
183
Abstract :
Solid freeform fabrication (SFF) methods offer unique opportunities for manufacturing electronic ceramics, specifically piezoelectric ceramics and ceramic/polymer composites (for sensing and actuating applications) free of constraints imposed by complexity of design or architecture. This is a direct result of the fact that these methods allow component manufacture without the need for hard tools/molds or costly machining. There are a number of SFF methods that have been developed since the introduction of stereolithography in the mid 1980´s. Only recently have some of these methods been successfully applied to advanced ceramic materials. This paper gives a brief introduction of the major commercial SFF methods. In addition, examples are given which show how SFF methods have been recently used to manufacture PZT ceramic/polymer composites for actuators and sensors. The paper will offer an indication of the potential that SFF offers to manufacture advance electronic ceramic materials
Keywords :
ceramic industry; electron device manufacture; filled polymers; lead compounds; manufacturing processes; materials preparation; photolithography; piezoceramics; piezoelectric actuators; piezoelectric transducers; PZT; PZT ceramic/polymer composites; PbZrO3TiO3; actuating applications; ceramic/polymer composites; component manufacture; electronic ceramics manufacturing; piezoelectric ceramics; sensing applications; solid freeform fabrication; stereolithography; Ceramics; Computer numerical control; Fabrication; Machining; Manufacturing; Polymers; Prototypes; Resins; Solids; Stereolithography;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on
Conference_Location :
East Brunswick, NJ
Print_ISBN :
0-7803-3355-1
Type :
conf
DOI :
10.1109/ISAF.1996.602732
Filename :
602732
Link To Document :
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