DocumentCode
3117441
Title
Bibliography of air cooled heat sinks for thermal enhancement of electronic packages
Author
Shaukatullah, H.
Author_Institution
IBM Corp., Endicott, NY, USA
fYear
1998
fDate
10-12 Mar 1998
Firstpage
177
Lastpage
221
Abstract
A bibliography of 847 publications dealing with air cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks, extended surfaces and adhesives for bonding heat sinks. The papers are classified in several categories
Keywords
adhesion; bibliographies; cooling; heat sinks; packaging; thermal analysis; adhesives; air cooled heat sinks; electronic package thermal enhancement; electronic packages; extended surfaces; heat sink bonding adhesives; heat sink design; heat sink performance analysis; Bibliographies; Books; Electronic components; Electronic packaging thermal management; Electronics cooling; Electronics packaging; Heat sinks; Microelectronics; Performance analysis; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1998. SEMI-THERM Proceedings 1998., Fourteenth Annual IEEE
Conference_Location
San Diego, CA
ISSN
1065-2221
Print_ISBN
0-7803-4486-3
Type
conf
DOI
10.1109/STHERM.1998.660404
Filename
660404
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