DocumentCode
3117465
Title
Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results
Author
Weidmann, Diane ; Dubois, Guillaume ; Hertl, Michael ; Chauffleur, Xavier
Author_Institution
Insidix, Seyssins, France
fYear
2011
fDate
18-20 April 2011
Firstpage
42375
Lastpage
42527
Abstract
The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.
Keywords
acoustic microscopy; deformation; electronics packaging; SAM; TDM; debonding localisation; deformation history; electronic packages; interface strength determination; package design; scanning acoustic microscopy; topography and deformation measurements; Joints; Polymers; Temperature dependence; Temperature measurement; Thermomechanical processes; Time division multiplexing; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
Conference_Location
Linz
Print_ISBN
978-1-4577-0107-8
Type
conf
DOI
10.1109/ESIME.2011.5765836
Filename
5765836
Link To Document