• DocumentCode
    3117465
  • Title

    Determination of strength of interface in packages based on an approach using coupling of experimental and modeling results

  • Author

    Weidmann, Diane ; Dubois, Guillaume ; Hertl, Michael ; Chauffleur, Xavier

  • Author_Institution
    Insidix, Seyssins, France
  • fYear
    2011
  • fDate
    18-20 April 2011
  • Firstpage
    42375
  • Lastpage
    42527
  • Abstract
    The aim of this paper is to present the work we realized to determinate the strength of interfaces in a package. The work consisted of coupling experimental and modelling results obtained on the package. The proposed method is very interesting because it can be directly applied on every package design realized in the field of manufacturing. The process consists of cutting the package in some axes in order to create different stress zones. We study the package before and after cutting by TDM, which provides us the deformation history of the package. Then we also use SAM, a process which allows debonding localisation. By matching and fitting experimental data on simulation, we succeed in determining unknown properties.
  • Keywords
    acoustic microscopy; deformation; electronics packaging; SAM; TDM; debonding localisation; deformation history; electronic packages; interface strength determination; package design; scanning acoustic microscopy; topography and deformation measurements; Joints; Polymers; Temperature dependence; Temperature measurement; Thermomechanical processes; Time division multiplexing; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on
  • Conference_Location
    Linz
  • Print_ISBN
    978-1-4577-0107-8
  • Type

    conf

  • DOI
    10.1109/ESIME.2011.5765836
  • Filename
    5765836