Comparative characterization of chip to epoxy interfaces by molecular modeling and contact angle determination

Author

Hölck, O. ; Bauer, J. ; Wittler, O. ; Michel, B. ; Wunderle, B.

Author_Institution

Fraunhofer Inst. for Reliability & Microintegration (IZM), Berlin, Germany

fYear

2011

fDate

18-20 April 2011

Firstpage

42376

Lastpage

42558

Abstract

An investigation of interfacial interaction has been performed between an industry oriented epoxy molding compound Epoxy Phenol Novolac (EPN) and its filled variety EPN^F (with silica particles) and a native silicon dioxide layer (SiO₂) usually found at chip surfaces. The free surfaces of both solid materials were experimentally analysed by contact angle measurements of three different liquids (water, methylene-iodide (MI) and glycerol). Results are compared to interfacial energies obtained by analysis of the interfaces in bimaterial molecular models, yielding reasonable agreement. A qualitative prediction regarding the influence of water on the interfacial strength between chip and molding compound is attempted.

Keywords

integrated circuit packaging; silicon compounds; EPN; bimaterial molecular models; chip-to-epoxy interfaces; comparative characterization; contact angle determination; contact angle measurements; epoxy phenol novolac; industry-oriented epoxy molding compound; interfacial energies; interfacial interaction; interfacial strength; molecular modeling; silica particles; silicon dioxide layer; Analytical models; Atomic measurements; Electrostatics; Elementary particle vacuum; Lead; Liquids;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2011 12th International Conference on

Conference_Location

Linz

Print_ISBN

978-1-4577-0107-8

Type

conf

DOI

10.1109/ESIME.2011.5765840

Filename

5765840