• DocumentCode
    3117594
  • Title

    Electrical insulations systems-`A total package´

  • Author

    Clark, Brent M.

  • Author_Institution
    E.I. du Pont de Nemours & Co., Wilmington, DE, USA
  • fYear
    1989
  • fDate
    25-28 Sep 1989
  • Firstpage
    125
  • Lastpage
    129
  • Abstract
    The advantages of a total-package approach to electrical insulation systems are described. Total package systems offer today´s manufacturer a large choice of bobbin materials, interwinding materials, magnet wires, and varnishes of all types, as well as a multitude of minor components. It is noted that choosing one of these systems can save the manufacturer of transformers, motors, solenoids, relays, or power supplies not only much of the testing costs but also time getting the product to the marketplace. Particular emphasis is placed on Du Pont´s total-package approach, which has sought to meet the following key electrical manufacturer requirements: IEC and UL recognition of the systems; systems available in most temperature classes; systems using the most up-to-date ingredients (as well as the old proven standbys); the widest possible choices of major and minor components; ingredients obtainable on a global basis; and free authorization to use these systems
  • Keywords
    coils; machine windings; standards; IEC recognition; UL recognition; bobbin materials; electrical insulation systems; electrical manufacturer requirements; free authorization; global basis; interwinding materials; magnet wires; major components; minor components; motors; power supplies; relays; solenoids; standards; temperature classes; testing costs; time to market; total-package; transformers; varnishes; Dielectrics and electrical insulation; Magnetic materials; Manufacturing; Packaging; Power supplies; Power system relaying; Power transformer insulation; Solenoids; System testing; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/EEIC.1989.208208
  • Filename
    208208