DocumentCode
3117638
Title
Injection molding of electrical parts in today´s materials
Author
Douglas, Ron D.
Author_Institution
Tech. Plastics Corp., Poplar Bluff, MO, USA
fYear
1989
fDate
25-28 Sep 1989
Firstpage
133
Lastpage
136
Abstract
It is noted that the molding of electrical components such as bobbins, housing, and bases has become more challenging with the advent of higher heat and electrical property materials such as PET (polyethylene terephthalate), PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), and others. The successful production of these parts is a combination of proper mold design and construction, preparation of molding material, processing, and monitoring of both part parameters and process parameters. Therefore, close communication between the product designer, manufacturing engineer, mold designer, moldmaker, and molder is necessary to achieve successful results. Particular attention is given to the molding of engineering resins, with emphasis on material preparation, melt temperature, mold temperature, molding machine temperature, and quality control
Keywords
organic insulating materials; plastics; polymers; quality control; PBT; PET; PPS; bases; bobbins; electrical components; engineering resins; higher electrical property materials; higher heat materials; housing; injection molding; manufacturing engineer; material preparation; melt temperature; mold construction; mold design; mold designer; mold temperature; molder; molding machine temperature; moldmaker; monitoring; polybutylene terephthalate; polyethylene terephthalate; polyphenylene sulfide; process parameters; product designer; quality control; Building materials; Condition monitoring; Design engineering; Injection molding; Manufacturing; Polyethylene; Positron emission tomography; Product design; Production; Resistance heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
Conference_Location
Chicago, IL
Type
conf
DOI
10.1109/EEIC.1989.208210
Filename
208210
Link To Document