• DocumentCode
    3117754
  • Title

    Block-by-block link-path analysis and design with physics-based models

  • Author

    Drewniak, J.

  • Author_Institution
    UMR/MS&T EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO
  • fYear
    2008
  • fDate
    18-22 Aug. 2008
  • Firstpage
    1
  • Lastpage
    11
  • Abstract
    A collection of slides from the author´s conference presentation is given.
  • Keywords
    electromagnetic compatibility; metallisation; printed circuits; strip lines; EMC; TEM field; block-by-block link-path analysis; material discontinuity; multilayered PCB; stripline;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2008. EMC 2008. IEEE International Symposium on
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4244-1699-8
  • Electronic_ISBN
    978-1-4244-1698-1
  • Type

    conf

  • DOI
    10.1109/ISEMC.2008.4652245
  • Filename
    4652245
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3117754