Evaluation of newly developed heat resistant bondable magnet wire

A bondable magnet wire has been developed with modified polyimide as the bonding layer. This bondable wire has been shown to be quite usable both in elevated temperature services and in hermetic application involving refrigerants. A temperature as low as 150°C is sufficient to achieve adequate bonding strength for molding; the bonding strength remains sufficiently high at elevated temperatures beyond 100°C, and the new wire is more resistant to (refrigerator) oils than conventional bonding layer materials, while the stability in the refrigerant is just as good as for the latter