New high performance parallel bonded fine enamelled wire for hard disk drive head

Author

Takahashi, S. ; Hanaoka, K. ; Chabata, S. ; Tsuboi, T. ; Ito, K. ; Yotsuya, K.

Author_Institution

Fujikura Ltd., Tokyo, Japan

fYear

1989

fDate

25-28 Sep 1989

Firstpage

173

Lastpage

179

Abstract

Data are presented characterizing high-performance parallel bonded fine enamelled wires which have been applied to HDD (hard disk drive) heads. This wire {OFC 2P-UEWB(RG)SL} is shown to be superior in mechanical strength, electrical insulation properties, and high-frequency characteristics to the single wire which has been widely used for HDD heads. This parallel wire has the same clean solderability, chemical resistance, and thermal life as single wire. In addition, the parallel wire has excellent automatic windability, and it has better hand-windability than single wire. Special oxygen-free copper-type parallel bonded wire {AOFC 2P-UEWB(RG)SL} is very suitable for finer size wire

Keywords

hard discs; insulated wires; magnetic heads; HDD; automatic windability; chemical resistance; electrical insulation properties; hand-windability; hard disk drive head; high-frequency characteristics; mechanical strength; parallel bonded fine enamelled wire; solderability; thermal life; Bonding; Coils; Disk drives; Fluctuations; Hard disks; Inductance; Magnetic heads; Mechanical factors; Research and development; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th

Conference_Location

Chicago, IL

Type

conf

DOI

10.1109/EEIC.1989.208219

Filename

208219