Discussion of new developments in solventless polyester varnishes-methods to meet EPA regulations and improve quality

Author

Battisti, Angelo J. ; Lin, Ching-Li

Author_Institution

John C. Dolph Co., Monmouth Junction, NJ, USA

fYear

1989

fDate

25-28 Sept. 1989

Firstpage

199

Lastpage

203

Abstract

An extensive study to determine the factors affecting buildup, flexibility, and mechanical properties of the base resins of solventless electrical varnishes is reported. The base resin formulation and monomer selection were found to have a significant effect on all properties. As a result of this study, a new solventless varnish has been developed that incorporates the high build and flexible characteristics of conventional solvent-type varnishes with the high flash point, low VOC (volatile organic compound), and high bond strength of conventional solventless varnishes.<>

Keywords

organic insulating materials; polymers; varnish; EPA regulations; VOC; base resin formulation; bond strength; flash point; flexible characteristics; mechanical properties; monomer selection; quality; solventless polyester varnishes; volatile organic compound; Bonding; Digital audio players; Electrical safety; Electromagnetic devices; Manufacturing; Mechanical factors; Production; Protection; Resins; Solvents;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th

Conference_Location

Chicago, IL, USA

Type

conf

DOI

10.1109/EEIC.1989.208224

Filename

208224