DocumentCode :
3118037
Title :
A discharge locating probe for rotating machines
Author :
Sedding, H.G. ; Stone, G.C.
Author_Institution :
Ontario Hydro, Toronto, Ont., Canada
fYear :
1989
fDate :
25-28 Sep 1989
Firstpage :
225
Lastpage :
227
Abstract :
The Tennessee Valley Authority (TVA) probe permits location of partial discharge (PD) since it is sensitive to radio frequency signals produced by PD. However, the present TVA probe has limitations both in directionality and in providing quantitative measurements for comparison of different windings. The authors present the basic principles of detection of an improved TVA probe, known as the discharge locating (DL) probe, which was developed to be an evolutionary upgrade to the TVA probe. The principal features of the new device are very-high-frequency detection using a capacitive sensor and microprocessor-based signal processing. These features are intended to make the probe easier to use and less ambiguous in the interpretation of results. The coupling technique used permits significantly improved spatial resolution of the discharge source and immunity to radiated electrical interference. Field evaluation of the DL probe has generally been successful, with the results confirming theoretical and laboratory-based studies of the device
Keywords :
electric sensing devices; machine testing; partial discharges; probes; signal processing equipment; Tennessee Valley Authority; capacitive sensor; coupling technique; directionality; discharge locating; discharge locating probe; microprocessor-based signal processing; partial discharge; quantitative measurements; radiated electrical interference; radio frequency signals; rotating machines; spatial resolution; Capacitive sensors; Fault location; Frequency measurement; Partial discharge measurement; Partial discharges; Probes; RF signals; Radio frequency; Rotating machines; Signal processing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
Conference_Location :
Chicago, IL
Type :
conf
DOI :
10.1109/EEIC.1989.208230
Filename :
208230
Link To Document :
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