Title :
60 GHz flip-chip assembled MIC design considering chip-substrate effect
Author :
Arai, Y. ; Sato, M. ; Yamada, H.T. ; Hamada, T. ; Nagai, K. ; Fujishiro, H.I.
Author_Institution :
Semicond. Technol. Lab., Oki Electr. Ind. Co. Ltd., Tokyo, Japan
Abstract :
In this paper, a 60 GHz MICs with flip-chip assembled pseudomorphic-HEMT is demonstrated. With electromagnetic field analysis, the assembly effect was estimated. An amplifier has a gain of 13 dB and a 30/60 GHz frequency doubler has a gain of -3 dB. Measured and simulated results clarify the potential of the structure and design method.
Keywords :
HEMT circuits; equivalent circuits; flip-chip devices; frequency multipliers; hybrid integrated circuits; microassembling; millimetre wave amplifiers; millimetre wave frequency convertors; millimetre wave integrated circuits; 13 dB; 30 GHz; 60 GHz; EHF; MM-wave amplifier; MM-wave frequency doubler; PHEMT; chip-substrate effect; design method; electromagnetic field analysis; flip-chip assembled MIC design; pseudomorphic HEMT; Admittance; Assembly; Capacitance measurement; Circuit simulation; Electromagnetic fields; Equivalent circuits; HEMTs; Microwave integrated circuits; Semiconductor device measurement; Substrates;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.602829
