Title :
Silicon-based micromachined packages for discrete components
Author :
Henderson, R.M. ; Katehi, L.P.B.
Author_Institution :
Radiat. Lab., Michigan Univ., Ann Arbor, MI, USA
Abstract :
A novel approach has been taken to develop low cost, high frequency (Ka-band), electronic packages. An existing thick film package for a phase shifter chip has been redesigned using silicon as the base material. This paper reports on the fabrication techniques and the measurement improvement found by coupling silicon micromachining techniques with standard IC processing.
Keywords :
micromachining; microwave phase shifters; packaging; silicon; IC processing; Ka-band; Si; electronic packaging; fabrication; high frequency discrete component; phase shifter chip; silicon micromachining; Costs; Electronics packaging; Fabrication; Frequency; Measurement standards; Micromachining; Phase shifters; Semiconductor device measurement; Silicon; Thick films;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.602846
