Title :
Unaccelerated reliability testing for T/R modules: need, methodology and supporting data
Author :
Kopp, B.A. ; Axness, T.A. ; Moore, C.R.
Author_Institution :
Appl. Phys. Lab., Johns Hopkins Univ., Laurel, MD, USA
Abstract :
MMIC temperature accelerated test data often does not capture many reliability degradation mechanisms present in transmit/receive (T/R) modules. Unaccelerated T/R module reliability testing can be used to help identify these mechanisms. This paper will identify several T/R module degradation mechanisms, a test methodology to obtain the maximum amount of information from unaccelerated test data, and supporting experimental data.
Keywords :
MMIC; active antenna arrays; failure analysis; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; modules; transceivers; MMIC temperature accelerated test data; T/R modules; active arrays; failure rates; phased arrays; reliability degradation mechanisms; test methodology; transmit/receive modules; unaccelerated reliability testing; Acceleration; Degradation; Life estimation; Life testing; Low-noise amplifiers; MMICs; Power generation; Stress; Switches; Temperature;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.602860
