• DocumentCode
    3118377
  • Title

    Prevention of slot discharge and on-line condition monitoring of high voltage machine insulation

  • Author

    Basu, A.

  • fYear
    1989
  • fDate
    25-28 Sep 1989
  • Firstpage
    305
  • Lastpage
    309
  • Abstract
    The various factors responsible for slot discharge damage are discussed. The lowering of surface resistance in combination with lamination edges is shown to be an important factor in establishing the conditions of the initial discharge. Space charges on the free surface on the coil can cause the development of a large voltage when the coil vibrates in the slot. This leads to discharges to the coating. A magnetic field effect in conjunction with a thermal effect can create a free surface or an isolated painted area responsible for the onset of discharges. A novel insulation technique has been developed which practically eliminates the slot discharge phenomena. The technique provides a reliable and stable electrical path for allowing the capacitive current of the main insulation to ground. An additional feature of this development is the provision of a simple online condition monitoring method. Information can be obtained about any discharging condition, ground fault in an isolated neutral system, and interturn fault that could lead to ground insulation failure
  • Keywords
    insulation testing; machine insulation; surface discharges; capacitive current; coil; electrical path; ground fault; high voltage machine insulation; initial discharge; interturn fault; isolated painted area; lamination edges; magnetic field effect; on-line condition monitoring; slot discharge; surface resistance; thermal effect; Coils; Condition monitoring; Conductivity; Dielectrics and electrical insulation; Fault location; Machine windings; Power transformer insulation; Stator windings; Surface discharges; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Electronics Insulation Conference, 1989. Chicago '89 EEIC/ICWA Exposition., Proceedings of the 19th
  • Conference_Location
    Chicago, IL
  • Type

    conf

  • DOI
    10.1109/EEIC.1989.208247
  • Filename
    208247