Title :
A fast time domain integral equation technique for analyzing EMC/EMI problems
Author :
Ayglin, K. ; Shanker, B. ; Ergin, A.A. ; Michielssen, E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
Abstract :
A novel time domain integral equation based algorithm is proposed for analyzing EMC/EMI problems where the problem geometry is modeled by three dimensional arbitrarily shaped perfect electrically conducting surfaces and wires. For example, the proposed algorithm enables the analysis of radiation from modules on motherboards, cables, and shielding structures with and without apertures. The algorithm is constructed by augmenting a classical marching-on-in-time (MOT) scheme with the plane wave time domain (PWTD) algorithm. The PWTD algorithm enables the fast evaluation of transient fields by decomposing them into transient plane waves. The computational complexity of the resulting PWTD-MOT algorithm scales as O(N/sub T/N/sub S//sup 1.5/log/sup 2/N/sub S/) as opposed to O(N/sub T/N/sub S//sup 2/) for a classical MOT algorithm, where N/sub T/ and N/sub S/ are the number of temporal and spatial basis functions discretizing the current density on the geometry.
Keywords :
electromagnetic compatibility; electromagnetic interference; integral equations; time-domain analysis; transient analysis; EMC; EMI; MOT scheme; PWTD algorithm; PWTD-MOT algorithm; apertures; cables; computational complexity; current density; fast time domain integral equation technique; marching-on-in-time scheme; modules; motherboards; plane wave time domain algorithm; problem geometry; shielding structures; spatial basis functions; temporal basis functions; three dimensional arbitrarily shaped perfect electrically conducting surfaces; transient fields; transient plane waves; wires; Algorithm design and analysis; Apertures; Cables; Electromagnetic compatibility; Electromagnetic interference; Geometry; Integral equations; Solid modeling; Time domain analysis; Wires;
Conference_Titel :
Antennas and Propagation Society International Symposium, 1999. IEEE
Conference_Location :
Orlando, FL, USA
Print_ISBN :
0-7803-5639-x
DOI :
10.1109/APS.1999.789568