Title :
A flip chip bonding technology using gold pillars for millimeter-wave applications
Author :
Aoki, S. ; Someta, H. ; Yokokawa, S. ; Ono, K. ; Hirose, T. ; Ohashi, Y.
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
Abstract :
This paper reports a flip chip bonding technology for a millimeter-wave monolithic integrated circuit (MIMIC) using gold micropillars with a controlled air gap instead of conventional wire bonding. We focus on their electrical performance in the W-band and their reliability against stresses expected in automotive radar applications.
Keywords :
MIMIC; flip-chip devices; gold; integrated circuit technology; Au; W-band; air gap; automotive radar; electrical performance; flip chip bonding technology; gold pillar; millimeter-wave monolithic integrated circuit; reliability; stress; Automotive engineering; Bonding; Flip chip; Gold; Integrated circuit reliability; Integrated circuit technology; MIMICs; Radar applications; Stress; Wire;
Conference_Titel :
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location :
Denver, CO, USA
Print_ISBN :
0-7803-3814-6
DOI :
10.1109/MWSYM.1997.602894
